Industry Days - Additive Manufacturing for RF/Microwave hardware

Micro laser sintering as a tool to manufacture tiny solid structures for RF hardware (3D MicroPrint GmbH)

23 Nov 2016, 11:55

25m

NA052 -Erasmus Conference Room (ESA/ESTEC)

Speaker

Mr Daniel Weber (3D MicroPrint GmbH)

Description

We will introduce Micro Laser Sintering (MLS) and company 3D MicroPrint GmbH and their capabilities of printing solid high-resolutionally metal parts. We will demonstrate how we develop new applications and demonstrate the possibilities of collaboration. We will show examples of applications and show real parts to touch. We will manufacture a demonstrator part related to RF/microwave to show the functions.

JUSTIFICATION FOR THE CONSIDERATION

With MLS you've a great technology to print dense and resolutinally parts in almost every type of metal. We have a laser spot size of 30 µm and use powder < 5 µm. Due to this we can achieve a high resolution and a high surface quality with a high density > 99.9 %.
We can manufacture hybrid parts, where we have a base out of ceramic to isolate the antenna strucure against electricity. Everything is adaptable and can be tailored for the application purpose.