Speakers
Description
Phase change materials have been investigated in order to damp fast but short thermal loads for platform application on specific electronic equipments. Beside thermo-elastic performance reduction could be challenged by combining a very low CTE material like Invar with a PCM material allowing to improve global thermal inertia.
Elementary characterization of different PCMs will be presented as well as potential applications and gain in performances.
Main objectives of thermal design for thermo-elastic purpose will be presented. Breadboard and test sequences will be detailed as well as results of breadboard testing under vacuum to check interest of such solutions from a technical and cost point of view. Preliminary correlation of tests results will be also assessed.
