Speaker
Description
Electronic boxes are a critical part of a satellite, housing several heat-dissipating components with strict thermal and structural constraints. Their design is one of the focal points of the overall thermal behavior of the satellite, while also needing to withstand significant mechanical loads during launch, as well as fatigue and thermal stresses throughout the mission lifecycle.
The aim of this work is to simulate thermal stress on one of such electronic boxes, presenting all the different steps. The process begins with preparing the geometry for both thermal and structural models. The thermal model is then configured by importing the meshed geometry, applying appropriate contactors, and defining heat loads based on operational conditions. Subsequently, the structural model is prepared using the same geometry, incorporating bolted connections and relevant boundary constraints. The final step involves mapping the thermal results directly onto the structural mesh, enabling the calculation of thermal stresses as external loads.
This workflow enables accurate assessment of thermal-induced stresses using coupled thermal and structural analysis. It supports early design decisions and improves the reliability of satellite electronic units under operational conditions.
