Speaker
Description
Miniaturization and thermal management of electronic systems are critical challenges in spacecraft design. EHP aims to develop a standardized, lightweight, and efficient two-phase cooling solution for high-density electronic boxes (E-Boxes).
EHP proposes a modular concept combining additive manufacturing and porous structures properties, allowing to dissipate at least 10W on any place of a 300mmx180mm structure or 50W for a 100mmx180mm structure. The system ensures passive, two-phase heat transfer from chip-level hotspots to the E-Box walls. The solution aligns with ESA's roadmap goals in advanced manufacturing and miniaturization and offers a competitive alternative to metallic straps and traditional Loop Heat Pipes, targeting a scalable market of over 10,000 PCB units per year.
The first breadboards have been produced, using aluminum for the casing and the porous structure, and ammonia as working fluid. From the temperature perspective, the components must not reach a too large temperature (typically 90°C) while the cold source is at maximum 65°C. The start-up temperature is -35°C. Testing is currently ongoing.
