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DARE User Day

8 December 2014
ESA/ESTEC
CET timezone

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Contribution List

24 out of 24 displayed
  1. 21. Relationship of DARE to the ESA micro-electronics section and ESA’s vision on reusable IP
    Mr Agustin Fernandez-Leon (ESA), Mr Boris Glass (ESA), Dr Richard Jansen (ESA)
    08/12/2014, 13:30
  2. 22. Introduction to the DARE platforms
    Mr Steven Redant (imec)
    08/12/2014, 13:50
    Flexible and portable solutions for mixed-signal and full custom analog space products built on the imec IC-Link services portfolio as an enabler for collaboration between IP providers and design companies using leading industrial foundries and qualification services.
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  3. 0. Aeroflex-Gaisler: SpaceWire Router and other chips
    Mr Sandi Habinc (Aeroflex Gaisler AB)
    08/12/2014, 14:10
  4. 1. Easics: Companion Chip for High-End Scientific Image Sensors
    Mr Ramses Valvekens (Easics)
    08/12/2014, 14:25
  5. 2. Thales Alenia Space Belgium: DPC
    Mr Marc Fossion (Thales Alenia Space)
    08/12/2014, 14:40
  6. 3. Arquimea: RedSat and Cosmic Vision HF chip
    Mr Daniel Gonzalez (Arquimea)
    08/12/2014, 14:55
  7. 4. Aeroflex-Gaisler: SpaceWire Router, LEONDARE, LVDS chip and micro-controller
    08/12/2014, 15:10
    Application chip poster
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  8. 23. Arquimea: DARE IP portfolio
    08/12/2014, 15:10
    IP Poster
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  9. 9. Arquimea: Red Sat and Cosmic Vision
    08/12/2014, 15:10
    Application chip poster
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  10. 5. ESA: CAN transceiver
    08/12/2014, 15:10
    Application chip poster
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  11. 10. ICSense: DARE IP overview
    08/12/2014, 15:10
    IP poster
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  12. 12. Imec: DARE IP overview
    08/12/2014, 15:10
    IP poster
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  13. 11. Recore: XentiumDARE
    08/12/2014, 15:10
    IP poster
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  14. 6. SABCA: Control Loop Processor
    08/12/2014, 15:10
    Application chip poster
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  15. 7. Thales Alenia Space Belgium: DPC/DPC2
    08/12/2014, 15:10
    Application chip poster
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  16. 8. Thales Alenia Space Espania: SSDP
    08/12/2014, 15:10
    Application chip poster
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  17. 18. DARE platforms development and status
    08/12/2014, 16:30
    Platforms discussed: o DARE180U (UMC L180 MM/RF 1.8V/3.3V, Single Poly 6 Metal (1P6M), PSub/Twin-Well CMOS) (Staf Vergaegen) o DARE180UC (UMC L180 CIS 1.8V/3.3V, Dual Poly 4 Metal (2P4M), P-Sub/Twin-Well CMOS) (Geert Thys) o DARE180X/DARE180XL (XFAB XH018 0.18 μm Modular Mixed Signal HV CMOS) (Giancarlo Franciscatto) o DARE350 (OnSemi I3T80 ) (Staf Verhaegen)
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  18. 19. Imec IC-links ESCC compliant ASIC manufacturing and qualification services
    Mr Tom Raman (imec)
    08/12/2014, 17:10
  19. 20. Collaboration with CERN on 65nm SRAM compiler
    Mr Wim Sijbers (imec)
    08/12/2014, 17:30
  20. 13. Relationship of DARE to the ESA micro-electronics section
  21. 16. The full-custom design support of the DARE platforms
  22. 14. The integration of the DARE platforms in the imec IC-Link services portfolio
  23. 15. The mixed-signal ASIC design flexibility including reusable hard IP
  24. 17. The technology portability of the DARE platforms