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DARE User Day

8 December 2014
ESA/ESTEC
CET timezone

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Contribution List

24 / 24
21. Relationship of DARE to the ESA micro-electronics section and ESA’s vision on reusable IP
Mr Agustin Fernandez-Leon (ESA), Mr Boris Glass (ESA), Dr Richard Jansen (ESA)
08/12/2014, 13:30
22. Introduction to the DARE platforms
Mr Steven Redant (imec)
08/12/2014, 13:50
Flexible and portable solutions for mixed-signal and full custom analog space products built on the imec IC-Link services portfolio as an enabler for collaboration between IP providers and design companies using leading industrial foundries and qualification services.
0. Aeroflex-Gaisler: SpaceWire Router and other chips
Mr Sandi Habinc (Aeroflex Gaisler AB)
08/12/2014, 14:10
1. Easics: Companion Chip for High-End Scientific Image Sensors
Mr Ramses Valvekens (Easics)
08/12/2014, 14:25
2. Thales Alenia Space Belgium: DPC
Mr Marc Fossion (Thales Alenia Space)
08/12/2014, 14:40
3. Arquimea: RedSat and Cosmic Vision HF chip
Mr Daniel Gonzalez (Arquimea)
08/12/2014, 14:55
4. Aeroflex-Gaisler: SpaceWire Router, LEONDARE, LVDS chip and micro-controller
08/12/2014, 15:10
Application chip poster
23. Arquimea: DARE IP portfolio
08/12/2014, 15:10
IP Poster
9. Arquimea: Red Sat and Cosmic Vision
08/12/2014, 15:10
Application chip poster
5. ESA: CAN transceiver
08/12/2014, 15:10
Application chip poster
10. ICSense: DARE IP overview
08/12/2014, 15:10
IP poster
12. Imec: DARE IP overview
08/12/2014, 15:10
IP poster
11. Recore: XentiumDARE
08/12/2014, 15:10
IP poster
6. SABCA: Control Loop Processor
08/12/2014, 15:10
Application chip poster
7. Thales Alenia Space Belgium: DPC/DPC2
08/12/2014, 15:10
Application chip poster
8. Thales Alenia Space Espania: SSDP
08/12/2014, 15:10
Application chip poster
18. DARE platforms development and status
08/12/2014, 16:30
Platforms discussed: o DARE180U (UMC L180 MM/RF 1.8V/3.3V, Single Poly 6 Metal (1P6M), PSub/Twin-Well CMOS) (Staf Vergaegen) o DARE180UC (UMC L180 CIS 1.8V/3.3V, Dual Poly 4 Metal (2P4M), P-Sub/Twin-Well CMOS) (Geert Thys) o DARE180X/DARE180XL (XFAB XH018 0.18 μm Modular Mixed Signal HV CMOS) (Giancarlo Franciscatto) o DARE350 (OnSemi I3T80 ) (Staf Verhaegen)
19. Imec IC-links ESCC compliant ASIC manufacturing and qualification services
Mr Tom Raman (imec)
08/12/2014, 17:10
20. Collaboration with CERN on 65nm SRAM compiler
Mr Wim Sijbers (imec)
08/12/2014, 17:30
13. Relationship of DARE to the ESA micro-electronics section
16. The full-custom design support of the DARE platforms
14. The integration of the DARE platforms in the imec IC-Link services portfolio
15. The mixed-signal ASIC design flexibility including reusable hard IP
17. The technology portability of the DARE platforms
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