DARE User Day

CET
Newton 2 (ESA/ESTEC)

Newton 2

ESA/ESTEC

Boris Glass (ESA), Richard Jansen (ESA)
Description
This is the second DARE User Meeting. The meeting will present progress of the DARE platforms in the last few years.
Attendees will get a better understanding of the extensive possibilities of DARE platforms developed by imec and its partners. In a first session the DARE platforms will be introduced and in the last session the current state of the existing platforms will be presented. In the second session the possibilities of the platforms will be shown using completed application chips as example with a broader portfolio including running available in the third session, which is a plenary poster session. In that poster session also an overview will be given of available IP.
In parallel, attendees will also be able to get insight in the portfolio of the ASICs that are made using the DARE solution and collect the information needed to include the chips in their upcoming designs. This information is also embedded in the presentations of session 2 and the application chip posters from session 3.
Participants
  • Alf Olsen
  • BANCELIN Bernard
  • Boris Glass
  • Bram De Muer
  • Constantin Papadas
  • Daniel González Gutiérrez
  • David Juliusson
  • Ernesto Pun
  • Fossion Marc
  • Frank Henkel
  • Geert Thys
  • Gerard Rauwerda
  • Giancarlo Franciscatto
  • Guillaume DEDEURWAERDER
  • Hans-Juergen Sedlmayr
  • Ioannis Tsatsaros
  • Jan Steinkamp
  • Jelle Talsma
  • Kim Sunesen
  • Marco Ruiz
  • Massimiliano Maranella
  • Moreno Lupi
  • Piet De Moor
  • Ramses Valvekens
  • Richard Jansen
  • Robert Leenheer
  • Sandi Habinc
  • Santiago Sondon
  • Staf Verhaegen
  • Steven De Cuyper
  • Steven Redant
  • Timothy Pike
  • Tom Raman
  • Tony REBOLLO
  • Wim Sijbers
    • 13:30 14:10
      Introduction
      • 13:30
        Relationship of DARE to the ESA micro-electronics section and ESA’s vision on reusable IP 20m
        Speakers: Mr Agustin Fernandez-Leon (ESA), Mr Boris Glass (ESA), Dr Richard Jansen (ESA)
        Slides
      • 13:50
        Introduction to the DARE platforms 20m
        Flexible and portable solutions for mixed-signal and full custom analog space products built on the imec IC-Link services portfolio as an enabler for collaboration between IP providers and design companies using leading industrial foundries and qualification services.
        Speaker: Mr Steven Redant (imec)
        Slides
    • 14:10 15:10
      DARE User ASICs
      • 14:10
        Aeroflex-Gaisler: SpaceWire Router and other chips 15m
        Speaker: Mr Sandi Habinc (Aeroflex Gaisler AB)
        Slides
      • 14:25
        Easics: Companion Chip for High-End Scientific Image Sensors 15m
        Speaker: Mr Ramses Valvekens (Easics)
        Slides
      • 14:40
        Thales Alenia Space Belgium: DPC 15m
        Speaker: Mr Marc Fossion (Thales Alenia Space)
        Slides
      • 14:55
        Arquimea: RedSat and Cosmic Vision HF chip 15m
        Speaker: Mr Daniel Gonzalez (Arquimea)
        Slides
    • 15:10 16:30
      Poster and demo session
      • 15:10
        Aeroflex-Gaisler: SpaceWire Router, LEONDARE, LVDS chip and micro-controller 1h 20m
        Application chip poster
      • 15:10
        Arquimea: DARE IP portfolio 1h 20m
        IP Poster
        Poster
      • 15:10
        Arquimea: Red Sat and Cosmic Vision 1h 20m
        Application chip poster
      • 15:10
        ESA: CAN transceiver 1h 20m
        Application chip poster
      • 15:10
        ICSense: DARE IP overview 1h 20m
        IP poster
        Poster
      • 15:10
        Imec: DARE IP overview 1h 20m
        IP poster
        Poster
      • 15:10
        Recore: XentiumDARE 1h 20m
        IP poster
        Poster
      • 15:10
        SABCA: Control Loop Processor 1h 20m
        Application chip poster
        Poster
      • 15:10
        Thales Alenia Space Belgium: DPC/DPC2 1h 20m
        Application chip poster
        Poster
      • 15:10
        Thales Alenia Space Espania: SSDP 1h 20m
        Application chip poster
    • 16:30 17:45
      DARE platforms and imec IC-Link radiation hardened ASIC services status
      • 16:30
        DARE platforms development and status 40m
        Platforms discussed: o DARE180U (UMC L180 MM/RF 1.8V/3.3V, Single Poly 6 Metal (1P6M), PSub/Twin-Well CMOS) (Staf Vergaegen) o DARE180UC (UMC L180 CIS 1.8V/3.3V, Dual Poly 4 Metal (2P4M), P-Sub/Twin-Well CMOS) (Geert Thys) o DARE180X/DARE180XL (XFAB XH018 0.18 μm Modular Mixed Signal HV CMOS) (Giancarlo Franciscatto) o DARE350 (OnSemi I3T80 ) (Staf Verhaegen)
      • 17:30
        Collaboration with CERN on 65nm SRAM compiler 15m
        Speaker: Mr Wim Sijbers (imec)
        Slides