The agenda would be the following:
12.00 to 13.00 Co-Packaging Optics activities discussion (to be held jointly with Photonics Splinter session) - Room Db114
13.00 to 14.00 Lunch Break
14.00 to 16.00 ESA presentation on Packaging and IC substrates GSTP EEE Initiative (In collaboration with PCB CTB WG) - Db172
16.00 to 17.00 Packaging solution for UDSM technologies (to be held jointly with UDSM Splinter session) - Erasmus High Bay
