Mr
Matt Booker
(ALTER TECHNOLOGY TÜV NORD UK Ltd)
28/05/2021, 15:50
Other topics
oral presentation
The European and UK semiconductor industry have been demanding a low cost plastic package solution for microcircuits in low to medium volumes. High volume lines for outsourced assembly and test (OSAT), mostly based in Asia, are dominated by consumer, mobile and automotive applications.
Although assembly of initial prototypes and small quantities into cavity packages can be provided in...
