25–28 May 2021
Online
Europe/Amsterdam timezone

Session

Packages, Assembly, and Supply Chain

PAS
28 May 2021, 15:50
Online

Online

Virtual Event

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  1. Mr Matt Booker (ALTER TECHNOLOGY TÜV NORD UK Ltd)
    28/05/2021, 15:50
    Other topics
    oral presentation

    The European and UK semiconductor industry have been demanding a low cost plastic package solution for microcircuits in low to medium volumes. High volume lines for outsourced assembly and test (OSAT), mostly based in Asia, are dominated by consumer, mobile and automotive applications.

    Although assembly of initial prototypes and small quantities into cavity packages can be provided in...

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