Speaker
Description
During this presentation, we will compare and evaluate the different workflows available in Simcenter 3D PCB Exchange and Simcenter 3D Space System Thermal for printed circuit board assembly analysis in the context of spacecraft thermal design. Component reliability is heavily dependent on temperature and so PCA thermal design and simulation is an important aspect of spacecraft development. The first aspect of PCA thermal analysis is the choice of data exchange format between ECAD (Electrical Computer Aided Design) and MCAD (Mechanical Computer Aided Design) software. Many data exchange formats are available for use in PCB exchange : IDF, Zuken, Gencad, ODB++ and IDX, each one shall be described and compared. We will also compare the various ways the Printed Circuit Board are thermally modelled in Simcenter 3D Space System Thermal, using average conductivity values or detailed conductivity fields that account for the copper content distribution in the various layers of the PCB. We will conclude this presentation by looking at the “assembly fem” concept in Simcenter 3D that enables the efficient re-use of these PCB board level models for the full spacecraft models.
