Electronic Materials and Processes for Space (EMPS) Workshop

Europe/Amsterdam
Virtual (On-line)

Virtual

On-line

Carole Villette (ESA) , Erwann Peraud (ESA) , Gianni Corocher (ESA) , Jussi Hokka (ESA) , Stan Heltzel (ESA) , Thomas Rohr (ESA/ESTEC)
Description

The effect of the space environment on the reliability of electronic materials and devices is of continuous concern and discussion. Therefore our knowledge needs to be continually expanded in order to improve the design, reliability and safety of launchers, spacecraft and space instruments. The key drivers for technology development are future mission requirements that are currently experiencing rapid advances in the performance requirements needed for scientific instruments. The selection of materials, processes and devices for future space missions must also anticipate the causes of environmental regulations (e.g. REACH, RoHS) and utilize cleaner technologies in order to mitigate the environmental impacts of space programs.

The focus of the EMPS Workshop is set on high-reliability manufacturing of electronic assemblies intended to withstand assembly, storage, ground test conditions and the conditions imposed by launchers and the space flight environments. The workshop aims to promote the development and awareness of materials and manufacturing processes utilized for space applications and to foster the discussion and exchanges of knowledge among the industry and research centres actively involved in space applications and other high-reliability electronics.

The workshop will take place online on 1st June 2021, and will be hosted on Webex. 

Registration is free of charge.

We are looking forward to meeting an international audience online in June 2021.

Registration
Participants
    • 09:00 09:05
      Workshop opening 5m
      Speaker: Thomas Rohr (ESA/ESTEC)
    • 09:05 11:15
      Session 1: Materials characterization & reliability testing
      Convener: Erwann Peraud (ESA)
      • 09:05
        Thermal expansion behavior of PCBs and electronic components 25m
        Speaker: Daniel Lager (AIT Austrian Institute of Technology)
      • 09:30
        Scanning Acoustic Microscopy: Non-destructive inspection of plastic COTS parts and beyond 25m
        Speaker: Francisco J. Aparicio (Alter Technology)
      • 09:55
        Material characterization, a necessary step for prediction of the PCB reliability 25m
        Speaker: Sebastien Mercier (Université de Lorraine)
      • 10:20
        ENEPIG evaluation, CAF testing and Harwell lab capabilities 30m
        Speakers: Martina Meisnar (ESA) , Joe Bennet (RAL)
      • 10:50
        Virtex 4 and Virtex 5 assembly verification testing 25m
        Speaker: Vincenzo Crinò (ADS)
    • 11:15 11:25
      Break 10m
    • 11:25 12:40
      Session 2: Emerging technologies
      Convener: Jussi Hokka (ESA)
      • 11:25
        Overview of R&D activites and ESA harmonisation roadmap 25m
        Speakers: Jussi Hokka (ESA) , Stan Heltzel (ESA)
      • 11:50
        ALD coatings to mitigate tin whiskers and for upgrade of environmental durability of electronic assemblies 25m
        Speaker: Marko Pudas (Picosun)
      • 12:15
        COTS and lead-free electronic assemblies 25m
        Speaker: Gianni Corocher (ESA)
    • 12:40 13:40
      Lunch 1h
    • 13:40 14:30
      Session 2: Emerging technologies
      • 13:40
        Robotic and low temperature soldering 25m
        Speaker: Bob Willis (BobWillisOnline)
      • 14:05
        Characterisation of 3D MID for space telecom applications (3D-MID4SPACE) 25m
        Speaker: Klaus Ruzicka (Art-of-technology)
    • 14:30 15:20
      Session 3: Advanced PCB technologies
      Convener: Stan Heltzel (ESA)
      • 14:30
        High-density PCB technology assessment for space applications 25m
        Speaker: Maarten Cauwe (IMEC)
      • 14:55
        HDI GSTP French consortium 25m
        Speaker: Philippe Pernot (Meredit)
    • 15:20 15:35
      Break 15m
    • 15:35 16:50
      Session 3: Advanced PCB technologies
      • 15:35
        Reliability of HDI PCBs: Thermo-mechanical simulations 25m
        Speaker: Chinmay Nawghane (IMEC)
      • 16:00
        An overview of PCB risks and supplier capability 25m
        Speaker: Bhanu Sood (NASA)
      • 16:25
        PCB embedding technologies 25m
        Speaker: Marek Kościelski (ITR)
    • 16:50 17:00
      Closing / Wrap Up 10m