Electronic Materials and Processes for Space (EMPS) Workshop

Tuesday 1 Jun 2021, 09:00 → 17:00 Europe/Amsterdam

Virtual (On-line)

Carole Villette (ESA), Erwann Peraud (ESA), Gianni Corocher (ESA), Jussi Hokka (ESA), Stan Heltzel (ESA), Thomas Rohr (ESA/ESTEC)

The effect of the space environment on the reliability of electronic materials and devices is of continuous concern and discussion. Therefore our knowledge needs to be continually expanded in order to improve the design, reliability and safety of launchers, spacecraft and space instruments. The key drivers for technology development are future mission requirements that are currently experiencing rapid advances in the performance requirements needed for scientific instruments. The selection of materials, processes and devices for future space missions must also anticipate the causes of environmental regulations (e.g. REACH, RoHS) and utilize cleaner technologies in order to mitigate the environmental impacts of space programs.

The focus of the EMPS Workshop is set on high-reliability manufacturing of electronic assemblies intended to withstand assembly, storage, ground test conditions and the conditions imposed by launchers and the space flight environments. The workshop aims to promote the development and awareness of materials and manufacturing processes utilized for space applications and to foster the discussion and exchanges of knowledge among the industry and research centres actively involved in space applications and other high-reliability electronics.

The workshop will take place online on 1st June 2021, and will be hosted on Webex. 

Registration is free of charge.

We are looking forward to meeting an international audience online in June 2021.

1 Workshop opening

Speaker: Thomas Rohr (ESA/ESTEC)

Session 1: Materials characterization & reliability testing

Convener: Gianni Corocher (ESA)

2 Thermophysical characterisation of materials and components – Thermal expansion measurements from -180 °C to 1600 °C

Speaker: Daniel Lager (AIT Austrian Institute of Technology)

3 Scanning Acoustic Microscopy: Non-destructive inspection of plastic COTS parts and beyond

Speaker: Raquel Cano (Alter Technology)

4 Material characterization, a necessary step for prediction of the PCB reliability

Speaker: Sebastien Mercier (Université de Lorraine)

5 ENEPIG evaluation, CAF testing and Harwell lab capabilities

Speakers: Martina Meisnar (ESA), Joe Bennet (RAL)

6 Lessons learned about the mounting process of FPGA for space application

Speaker: Vincenzo Crinò (ADS)

11:15 Break

Session 2: Emerging technologies

Convener: Jussi Hokka (ESA)

7 Overview of R&D activites and ESA harmonisation roadmap

Speakers: Jussi Hokka (ESA), Stan Heltzel (ESA)

8 ALD coatings to mitigate tin whiskers and for upgrade of environmental durability of electronic assemblies

Speaker: Marko Pudas (Picosun)

9 COTS and lead-free electronic assemblies

Speaker: Gianni Corocher (ESA)

12:40 Lunch

Session 2: Emerging technologies

10 Robotic and low temperature soldering

Speaker: Bob Willis (BobWillisOnline)

11 Characterisation of 3D MID for space telecom applications (3D-MID4SPACE)

Speaker: Klaus Ruzicka (Art-of-technology)

Session 3: Advanced PCB technologies

Convener: Stan Heltzel (ESA)

12 High-density PCB technology assessment for space applications

Speaker: Maarten Cauwe (IMEC)

13 HDI GSTP French consortium

Speaker: Philippe Pernot (Meredit)

15:20 Break

Session 3: Advanced PCB technologies

14 Reliability of HDI PCBs: Thermo-mechanical simulations

Speaker: Chinmay Nawghane (IMEC)

15 An overview of PCB risks and supplier capability

Speaker: Bhanu Sood (NASA)

16 PCB embedding technologies

Speaker: Wojciech Stęplewski

17 Closing / Wrap Up