19 September 2014
ESA/ESTEC
CET timezone

Scalable Sensor Data Processor Development Status

19 Sept 2014, 10:00
20m
Newton 2 (ESA/ESTEC)

Newton 2

ESA/ESTEC

Speaker

Mr Luis Berrojo (Thales Alenia Space España)

Description

The development status of the SSDP will be described during this talk. The Scalable Sensor Data Processor ASIC development activity is being performed in the frame of a CTP ESA funded project, led by Thales Alenia Space España in collaboration with RECORE Systems, IMEC and Arquimea. The aim of the activity is to design, verify, manufacture, and validate a multi-core payload data processor SSDP ASIC prototype. The SSDP processor is a Mixed signal SoC including 2 RECORE XENTIUM® VLIW Fixed Point DSP processors and a Leon FT processor, and associated peripherals for memory management and external data exchange. External data interfaces will be based in standard buses well established in the space industry such as SpaceWire, CAN, and SPI. The XENTIUM® subsystem will be connected by means of a RECORE proprietary high performance Network-on-Chip grid, while the LEON subsystem will be based in the traditional AMBA bus architecture. Both subsystems will be interconnected by a NoC/AHB bridge. Analog parts will include fast instrumentation- and housekeeping ADC converters, a 16 channel multiplexer, interfaces to temperature sensors, and a PLL. The purpose of this multi-core processor is to manage the wealth of data collected in future space missions, coping with the stringent radiation requirements of missions such as JUICE. IMEC DARE180 technology has been selected for implementation due to its proven radiation performances, mixed signal capabilities, and the availability of required Analog IP blocks SSDP will take advantage of previous projects like Massively Parallel Processing Breadboard (MPPB), DARE+ Application ASIC, and Next Generation Processing Platform (NGAPP) study. SSDP is conceived to ensure the availability of a high tech processor with the highest degree of flexibility, configurability, connectivity, scalable processing power, highly rad-tolerant, low power consumption, low mass, low volume to cover needs for future missions like JUICE, Lunar missions and Mars Landers.

Presentation materials