Speakers
Mr
Pierre-Eric Berthet
(3D PLUS)Mr
Pierre-Xiao WANG
(3D PLUS)
Description
FPGA based computer unite is quite common in space design thanks to FPGA’s high flexibility, high performance and its short time to market and unit low cost.
On the other side, whatever the application is, a SRAM based FPGA need to use the bitstream memory, and most cases computing memory and mass memory to build its eco system.
Cooperating with Nanoxplore, 3D PLUS develops a modular computer core: a single 3D stacking module based on first European radiation hardening FPGA NG-Medium. This single module can be considered as a complete computer with modular design, with microprocessor (inside of NG-Medium FPGA), memories, input/output (I/O) and other features required of a functional computer.
FUSIO RT integrates NG-Medium FPGA based on STM 65nm RH process. the FPGA has 550K Gates, integrated Space Wire interface, Multiple I/O power support from 1.5V to 3.3V, Cold sparing support, 800 Mbps I/O support, LVDS compatible mode and On-chip thermal monitoring capability.
To configure the FPGA, the module integrates 128Mb radiation tolerant high speed SPI memory with Triple Modular Redundancy (TMR) with embedded bit stream integrity check. This bitstream memory is the basic configuration of the FUSIO RT module, and 3D PLUS provide the develop kit to program the SPI memory.
Further than the bitstream memory, the users can select optional computing memory, radiation tolerant SDRAM – from x8 to x24b, which will add an additional stacking layer but keep the same module footprint. Along with different bus width, the SDRAM will be from 512Mb to 3Gb.
Same story for optional mass memory, the module can integrates radiation tolerant Nand Flash – from x8b to x32b bus to adapt to different speed, From 16Gb to 64Gb configurations, 100K erase/program cycle and 10 years data retention. In this case, the module will add one or two additional stacking layers and still keep in the same module footprint.
Moreover, as the space memory leader, 3D PLUS can provide SDRAM Controller IP core to manage the optional DRAM – max x24b wide computing memory, and also Nand Flash Controller IP core to manage the optional Nand – max x32b wide mass memory. These memory controller IP cores were tailored to 3D PLUS memories, and integrated radiation mitigation to make the memory radiation hardening by System (RHBS).
Last by not least, as a modular design, whatever the module configuration selected by the users: FPGA + only configuration memory or FPGA + configuration memory + computer memory or FPGA + configuration memory + computer memory + mass memory, this modular will be integrated Inside of same footprint: BGA484 1.27mm pitch (LxW=32x32mm), but with different height (more stacking layers) , and have minimum 262 user I/Os (in case of SPI+SDRAM+Flash) available, and Temperature range: -55 to +105°C.
Summary
Cooperating with Nanoxplore, 3D PLUS develops a modular computer core: a single 3D stacking module with the first European radiation hardening FPGA NG-Medium inside. This single stacking module integrates FPGA + bitstream memory + computing memory (optional) + mass memory (optional) with footproint of BGA484 and minimum 262 user I/Os available. The memories controller IP cores are provided too.
Primary author
Mr
Pierre-Xiao WANG
(3D PLUS)
Co-author
Mr
Pierre-Eric Berthet
(3D PLUS)
