Electronic Materials and Processes for Space (EMPS) Workshop

Session

Session 3

1 Jun 2021, 14:30

Virtual (On-line)

Conveners

Session 3: Advanced PCB technologies

• Stan Heltzel (ESA)

Session 3: Advanced PCB technologies

• There are no conveners in this block

13. High-density PCB technology assessment for space applications

Maarten Cauwe (IMEC)

01/06/2021, 14:30

14. HDI GSTP French consortium

Philippe Pernot (Meredit)

01/06/2021, 14:55

15. Reliability of HDI PCBs: Thermo-mechanical simulations

Chinmay Nawghane (IMEC)

01/06/2021, 15:35

16. An overview of PCB risks and supplier capability

Bhanu Sood (NASA)

01/06/2021, 16:00

17. PCB embedding technologies

Wojciech Stęplewski

01/06/2021, 16:25