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Electronic Materials and Processes for Space (EMPS) Workshop

1 June 2021
On-line
Europe/Amsterdam timezone

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Session

Session 3

1 Jun 2021, 14:30
Virtual (On-line)

Virtual

On-line

Conveners

Session 3: Advanced PCB technologies

  • Stan Heltzel (ESA)

Session 3: Advanced PCB technologies

  • There are no conveners in this block

Presentation materials

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  1. 13. High-density PCB technology assessment for space applications
    Maarten Cauwe (IMEC)
    01/06/2021, 14:30
  2. 14. HDI GSTP French consortium
    Philippe Pernot (Meredit)
    01/06/2021, 14:55
  3. 15. Reliability of HDI PCBs: Thermo-mechanical simulations
    Chinmay Nawghane (IMEC)
    01/06/2021, 15:35
  4. 16. An overview of PCB risks and supplier capability
    Bhanu Sood (NASA)
    01/06/2021, 16:00
  5. 17. PCB embedding technologies
    Wojciech Stęplewski
    01/06/2021, 16:25
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