Electronic Materials and Processes for Space (EMPS) Workshop

Session

Session 3

Jun 1, 2021, 2:30 PM

Virtual (On-line)

Conveners

Session 3: Advanced PCB technologies

• Stan Heltzel (ESA)

Session 3: Advanced PCB technologies

• There are no conveners in this block

13. High-density PCB technology assessment for space applications

Maarten Cauwe (IMEC)

6/1/21, 2:30 PM

14. HDI GSTP French consortium

Philippe Pernot (Meredit)

6/1/21, 2:55 PM

15. Reliability of HDI PCBs: Thermo-mechanical simulations

Chinmay Nawghane (IMEC)

6/1/21, 3:35 PM

16. An overview of PCB risks and supplier capability

Bhanu Sood (NASA)

6/1/21, 4:00 PM

17. PCB embedding technologies

Wojciech Stęplewski

6/1/21, 4:25 PM