14–16 Mar 2023
European Space Research and Technology Centre (ESTEC)
Europe/Amsterdam timezone
Presentations available

1Gb to 64Gb High reliability configuration solutions to boot the last generation of FPGAs (3D Plus)

14 Mar 2023, 15:45
25m
Erasmus High Bay (European Space Research and Technology Centre (ESTEC))

Erasmus High Bay

European Space Research and Technology Centre (ESTEC)

Keplerlaan 1 2201AZ Noordwijk ZH The Netherlands
Industrial Experiences Industrial Experiences

Speaker

Patrice BENARD (3D PLUS)

Description

Nowadays, SRAM-based FPGAs present an increasing need for high-density configuration memories on one hand, and for space applications, configuration memories must be hardened against the effects of radiation on the other hand. Today, there is a lack of rad tolerant high density configuration memories in the market. Moreover, some high performance SRAM-based FPGAs used for space applications might also need to be monitored and scrubbed to guarantee the system functionality during the mission.
In this talk, 3D PLUS presents 2 products to address these requirements, a 1Gb Magnetic non-volatile Random Access Memory (NVM) with serial interface (A-Mnemosyne) and a 64Gb space grade COnfiguration Memory BOot manager COMBO (B-Combo) designed to boot and scrub SRAM-Based FPGAs requiring large density configuration memories.

Primary authors

Amira Maalouf Jeanne Tongbong Patrice BENARD (3D PLUS)

Co-author

Amélie Gicquel (3D PLUS)

Presentation materials