Jan Steinkamp1, Frank Henkel1 , Volker Lück2, Dr. Ralf Symanczyk2
1 IMST GmbH, Carl-Friedrich-Gauss-Str.2-4, 47475 Kamp-Lintfort, Germany
2 TESAT-SPACECOM GmbH & Co. KG, Gerberstraße 49, 71522 Backnang, Germany
IMST and TESAT-Spacecom are working together in a DLR funded R&D project on the establishment of a qualified Mixed-Signal ASIC supply chain for space applications. This project is...
As soon as FinFET technology was shown to be a viable alternative to planar technology for nodes lower than 28nm, the radiation community has begun tests to characterize available technology from manufacturers such as Intel, Samsung, Global Foundries, TSMC and radiation testing and service providers [1][2][3][4]. A reduced SEE sensitivity has been observed due to lower carrier collection in...
The key features of the BCD6s SOI technology and the radiation performances measured on 4 rad-hard power ICs designed in this technology are presented, followed by an overview of the rad-hard design platform developed within these programs, including the hardened library and rad-hard hard IPs. The supply chain options up to the delivery of QML-V products assembled in high dissipation packages...
For several decades, Microchip provides one of the industry’s most comprehensive space product portfolio of radiation-hardened and radiation-tolerant solutions that includes high-performance MCUs, MPUs, FPGAs, memories, communication interfaces, frequency and timing solutions, mixed-signal ICs, custom power supplies, diodes, transistors, RF components and more. With product development...
