17-19 March 2020
European Space Research and Technology Centre (ESTEC)
Europe/Amsterdam timezone
UPDATE 02 March 2020: please be informed that SEFUW has been postponed. More information will be posted here in due course.

Methodologies and tools to efficiently perform fault campaigns to measure functional safety

18 Mar 2020, 09:50
20m
Newton 1 and 2 (European Space Research and Technology Centre (ESTEC))

Newton 1 and 2

European Space Research and Technology Centre (ESTEC)

Keplerlaan 1 2201AZ Noordwijk ZH The Netherlands
Fault Tolerance Methodologies and Tools Fault Tolerance Methodologies and Tools

Speaker

Mr Joerg Richter (Group Director R&D, Verification Group)

Description

Aerospace and Avionics ICs reliability depends on their ability to withstand the effects of radiation that naturally occurs in space and the Earth’s atmosphere. Radiation can cause Single Event Upsets (SEUs) and other types of faulty behavior in the design elements, which is transient by nature (recovery is possible). ICs are also susceptible to silicon aging effect, which may result in permanent faults (non-recoverable).
Measurements of effects of faults and their coverage through fault simulation is an area in Functional Safety that has been fast evolving in recent years, and could be leveraged for the aerospace chip design industry as well, both for soft IPs and for full FPGA designs. Methodologies and tools to measure safeness of potential faults, and the fault coverage of added safety mechanisms (such as TMR, ECC, DCLS etc.) have been implemented by various vendors. The challenge, though, is to enable an efficient and cost effective fault campaign to measure safeness and fault coverage on a modern, large scale design.
The presentation will demonstrate best-in-class tools and methodologies, using unified fault classification language, to manage the complex task of a fault campaign.

Primary authors

Mr Joerg Richter (Group Director R&D, Verification Group) Mrs Meirav Nitzan (Program Mgmt Director)

Presentation Materials

There are no materials yet.