Electronic Materials and Processes for Space (EMPS) Workshop

Tuesday, 1 June 2021 - 09:00
On-line (Virtual)

        : Sessions
    /     : Talks
        : Breaks
1 Jun 2021
AM
09:00 Workshop opening - Thomas Rohr (ESA/ESTEC)   (Virtual)
09:05
Session 1 - Erwann Peraud (ESA) (until 11:15) (Virtual)
09:05 Thermal expansion behavior of PCBs and electronic components - Daniel Lager (AIT Austrian Institute of Technology)   (Virtual)
09:30 Scanning Acoustic Microscopy: Non-destructive inspection of plastic COTS parts and beyond - Francisco J. Aparicio (Alter Technology)   (Virtual)
09:55 Material characterization, a necessary step for prediction of the PCB reliability - Sebastien Mercier (Université de Lorraine)   (Virtual)
10:20 ENEPIG evaluation, CAF testing and Harwell lab capabilities - Joe Bennet (RAL) Martina Meisnar (ESA)   (Virtual)
10:50 Virtex 4 and Virtex 5 assembly verification testing - Vincenzo Crinò (ADS)   (Virtual)
11:15 --- Break ---
11:25
Session 2 - Jussi Hokka (ESA) (until 12:40) (Virtual)
11:25 Overview of R&D activites and ESA harmonisation roadmap - Stan Heltzel (ESA) Jussi Hokka (ESA)   (Virtual)
11:50 ALD coatings to mitigate tin whiskers and for upgrade of environmental durability of electronic assemblies - Marko Pudas (Picosun)   (Virtual)
12:15 COTS and lead-free electronic assemblies - Gianni Corocher (ESA)   (Virtual)
PM
12:40 --- Lunch ---
13:40
Session 2 (until 14:30) (Virtual)
13:40 Robotic and low temperature soldering - Bob Willis (BobWillisOnline)   (Virtual)
14:05 Characterisation of 3D MID for space telecom applications (3D-MID4SPACE) - Klaus Ruzicka (Art-of-technology)   (Virtual)
14:30
Session 3 - Stan Heltzel (ESA) (until 15:20) (Virtual)
14:30 High-density PCB technology assessment for space applications - Maarten Cauwe (IMEC)   (Virtual)
14:55 HDI GSTP French consortium - Philippe Pernot (Meredit)   (Virtual)
15:20 --- Break ---
15:35
Session 3 (until 16:50) (Virtual)
15:35 Reliability of HDI PCBs: Thermo-mechanical simulations - Chinmay Nawghane (IMEC)   (Virtual)
16:00 An overview of PCB risks and supplier capability - Bhanu Sood (NASA)   (Virtual)
16:25 PCB embedding technologies - Marek Kościelski (ITR)   (Virtual)
16:50 Closing / Wrap Up   (Virtual)