Speaker
Description
High-performance computers designed for space applications face significant challenges related to excessive heat generation and high-power density within confined volumes. These issues arise due to the intense computational demands required for Earth observation space missions, future space data centers and systems in spacecrafts for processing data of all kinds. Managing heat dissipation and power density effectively becomes crucial to ensure the reliability of these advanced computing systems in the harsh environment of space. To address the challenges of high heat dissipation and overheating of the unit, KP Labs team proposes phase change material capacitor to reduce the thermal loads of the electronics.
In the study we present the concept stage of the heat capacitors development dedicated for electronics enclosures. The numerical model of the breadboard/prototype have been developed in the FloEFD software. The numerical model includes phase change material modelled with simplified formula. The hermetic chassis was designed and manufactured. Current preliminary vessel was filled with 40 grams of n-eicosane. Tests have been conducted in TVAC. The effect of PCM capacitor was observed during the experiment together with peculiar behavior of the material during the phase change. The numerical model was validated against the experimental results and such a model will be used in further development of the prototype which will consider using internal fins within the vessel to reduce the main drawback of PCM which is its low thermal conductivity. Further investigation is needed to assess the feasibility of technology is real space applications.
