AMICSA & DSP 2016

Session

Radiation-hardened technologies for analogue and mixed-signal ICs

13 Jun 2016, 14:00

Gothenburg, Sweden

Conveners

Radiation-hardened technologies for analogue and mixed-signal ICs

• Rok Dittrich (ESA)

12. Using a Standard Commercial Process for Full Custom Rad Hard Mixed-Signal Design

Mr Volker Lück (Tesat Spacecom)

13/06/2016, 14:00

AMICSA: Implementation of Radiation Hardening on analogue circuits at cell-, circuit-, and system design level

Oral

Mixed-signal design allows integration of further external discrete components and hence continues the dividend of integration. However, implementation of a mixed-signal flow into an operating digital or analog design flow is not a straight forward task. In space applications in addition, radiation is always an issue and ways need to be found to mitigate its effect on the circuit. Libraries...

22. Radiation-Hardened SiGe BiCMOS Technologies for Analogue and Mixed-Signal ICs

Mr Maurizio Cirillo (IHP GmbH)

13/06/2016, 14:20

AMICSA: Radiation-hardened technologies for analogue and mixed-signal ICs

Oral

IHP has been actively involved since many years in developing and providing un-restricted access to Process Design Kits (PDKs) for their high-performance 0.25µm and 0.13µm SiGe BiCMOS Technologies and professional services like Multi-Project-Wafer (MPW) and Low Volume (LV) manufacturing. In response to the strategic European Non-Dependence process for Critical Space Technologies for...

48. Incorporating more in-depth radiation knowledge in the DARE180U analog design kit

Mr Staf Verhaegen (imec)

13/06/2016, 14:40

AMICSA: Radiation-hardened technologies for analogue and mixed-signal ICs

Oral

DARE180U is a radiation hardened system-on-a-chip (SoC) design platform including mixed-signal and full-custom analogue circuits. It is built on the commercial UMC L180 MM/RF 1.8V/3.3V, Single Poly 6 Metal (1P6M), P-Sub/Twin-Well CMOS technology. In order to facilitate full custom radiation aware analogue design an analog design kit (ADK) is provided. From the start this ADK targeted...

30. Development of a Digital Temperature Transducer ASIC in a 28 nm FD-SOI CMOS Process for a Spaceborne Low Power Sensor Bus

Mr Markus Roner (OHB System AG, Munich, Germany), Mr Pragoti Pran Bora (Fraunhofer EMFT, Munich, Germany)

13/06/2016, 15:00

AMICSA: Space applications for analogue and mixed-signal ICs

Oral

A geostationary satellite typically employs as many as 1000 resistive temperature sensors for its housekeeping activities. These sensors are point-to-point wired to an acquisition unit, which is often a single central interrogator system. This poses a need to develop solutions that can reduce harness complexity and weight while maintaining high reliability and keeping low cost and power...