TEC-QEC Final Presentation days

Jun 28, 2023, 9:30 AM → Jun 30, 2023, 6:00 PM Europe/Amsterdam

ESTEC (ESA )

TEC-QEC

Final Presentation Day

 

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Radiation Hardness Assurance & Component Analysis Section (TEC-QEC) Final Presentation days

TEC-QEC Final Presentation Days will take place from on the 28-30 June 2023 at ESTEC.

During the event the major R&D activities and studies coordinated by TEC-QEC concluded between 2019 and 2022 will be presented .
 

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Registration is required to access the venue. (No participation fee)

Wednesday, June 28

2:00 PM → 2:30 PM Welcome & Introduction

2:30 PM → 6:00 PM Session 1: Facilities and Test Methods

2:30 PM Integreated SEE approach for SEE robust design

Comparison between Board level and component level testing (OSIP )

Speaker: Cesar Pablo Fernandez (Sener)

2:50 PM SEE testing with laser beam, guidelines

Speaker: Vincent Pouget (IES / CNRS)

3:20 PM Adoption of SEE laser testing as part of the RHA process for COTS screening and validation

Speakers: Sébastien Morand (Airbus DS), Renaud Mangeret (Airbus DS), Jérémy Guillermin (TRAD), Samuel Dubos (TRAD)

3:40 PM Board level testing

Speakers: Guillaume Montay (Sodern), Matthieu Beaumel (Sodern)

4:00 PM Coffee Break

4:30 PM RADEF - Facility activities overview and updates

Speaker: Heikki Kettunen (University of Jyväskylä, Department of Physics)

4:50 PM UCL - Facility activities overview and updates

Speakers: Nancy Postiau (Université catholique de Louvain), Laurent Standaert (Université catholique de Louvain)

5:10 PM PSI - Facility activities overview and updates

Speaker: Wojtek Hadjas (PSI)

5:30 PM CHIMERA - Facility activities overview and updates

Speakers: Andrea Coronetti (CERN), Andreas Waets (CERN), Ruben Garcia Alia (CERN)

6:30 PM → 7:30 PM Lab Visit : Materials and EEE compomnent (Optionnal)

Thursday, June 29

9:15 AM → 9:30 AM Welcome & Introduction

9:30 AM → 12:00 PM Session 2: In flight Data and Mission specific testing

9:30 AM Radiation testing of memories for the JUICE mission

TID and SEE test several types of LPDDR3, NAND flash, and NOR flash memories

Speakers: Bendy Tanios (Alter), Frederic Tilhac (Alter)

10:00 AM Publications - BepiColombo Radiation Monitor

Speaker: Marco Pinto (ESA)

10:20 AM In-Orbit results from Celesta

Speakers: Ruben Garcia Alia (CERN), Andrea Coronetti (CERN), Raffaello Secondo (CERN)

10:40 AM Coffee Break

11:00 AM Radiation-induced SEL in a COTS SRAM memory - Test and Flight data

Investigation on intra-die variability and radiation-induced SEL in a COTS SRAM memory flying on Proba-V + Flight data analysis of SEL in a COTS Samsung SRAM and comparison with SEE test results

Speakers: André Martins Pio De Mattos (LIRMM), Douglas Almeida dos Santos (LIRMM), Luigi Dilillo (LIRMM)

11:20 AM Part 1: Risk Assessment of SEE Events due to High Energy Electrons during the Juice Mission

Speaker: Alexandre Rousset (TRAD)

11:40 AM Part 2: Risk Assessment of SEE Events due to High Energy Electrons during the Juice Mission

Speaker: Maximilien Glorieux (IROC)

12:00 PM → 4:10 PM Session 3: Technology Studies

12:00 PM Lessons Learned for Stuckt bit testing

Set of recommendations for memory SEE stuck bit testing. (Stuck bits + ISB + SEFI + SEU)

Speaker: Said Bounasser (ESA)

12:20 PM SEE of SiC devices and analysis for radiation hardness assurance

Presentation of heavy ion test results on SiC MOSFET and diodes for RHA guidelines on SiC devices

Speakers: Aminata Carvalho (Airbus DS), Christian Binois (Airbus DS), Sébastien Morand (Airbus DS)

12:40 PM Lunch Break

1:55 PM Part 1: Estimation of proton induced single event rate in very deep submicron technologies

Speakers: Arto Javanainen (Jyväskylä University), Bendy Tanios (Alter)

2:15 PM Part 2: Estimation of proton induced single event rate in very deep submicron technologies

Speakers: Laurent Artola (ONERA), Maximilien Glorieux (IROC)

2:35 PM MOSFET Commercial plastic components survey (Trenchfet,...) and its SEE characterization

Speakers: Fernando Romero (Alter), José Francisco LARGAESPADA GÓMEZ (Alter)

2:55 PM Part 1: Radiation screening of COTS components and verification of COTS RHA approach

Speakers: Marta Bagatin (DEI - University of Padova), Simone Gerardin (DEI - University of Padova)

3:15 PM Part 2: Radiation screening of COTS components and verification of COTS RHA approach

Speakers: Peter Beck (Seibersdorf Laboratories), Christoph Tscherne (Seibersdorf Laboratories)

3:35 PM Coffee Break

4:10 PM → 4:50 PM Session 4: Radiation Test Results

4:10 PM RACOCO

Speakers: Jochen Kuhnhenn (Fraunhofer), Michael Steffens (Fraunhofer), Stefan Hoeffgen (Fraunhofer)

4:30 PM Test Results on SDRAM IS42S86400B-7TLI

Laser test results of the IS42S86400B-7TLI to explain the different SEFI mechanisms

Speaker: Maximilien Glorieux (IROC)

4:50 PM → 5:10 PM Annex Session

4:50 PM Introduction: Master RADMEP

Speaker: Paul Leroux (KU Leuven)

6:30 PM → 7:30 PM Lab Visit : Materials and EEE compomnent (Optionnal)

Friday, June 30

9:15 AM → 9:30 AM Welcome & Introduction

9:30 AM → 12:00 PM Session 4: Radiation Test Results

9:30 AM TID testing of statistically large quantitites of COTS parts

TID test results on a large quantity of a COTS LM239 voltage comparator from 2 different vendors

Speaker: Richard Sharp (Radtest Ltd)

9:50 AM Heavy Ion SEE Testing of Microsemi RTG4 flash based FPGA

SEE of a two LEON FT core processor design in RTG4 FPGA

Speaker: Richard Sharp (Radtest Ltd)

10:10 AM SEE tests on power Schottky Diodes

Speaker: Alexandre Rousset (TRAD)

10:30 AM Coffee Break

11:00 AM Heavy ion failure rate computation based on sensitive volume characterization in GaN/AlGaN FETs

Speaker: Sébastien Morand (Airbus Defence and Space)

11:20 AM Radiation characterisation of EEE components for ESA space applications

TID and SEE test results on COTS

Speakers: Jens Lundell (Beyond Gravity), Keijo Nystrom (Beyond Gravity), Pasi Taipalus (Beyond Gravity)

11:40 AM Evaluation of Spin transfer torque DDR MRAM in Space environmenrt

Speakers: Anthony Berne (Thales Alenia Space), Ronan Marec (Thales Alenia Space)

2:00 PM → 3:00 PM Lab Visit : Materials and EEE compomnent (Optionnal)