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Radiation Hardness Assurance & Component Analysis Section (TEC-QEC) Final Presentation days
TEC-QEC Final Presentation Days will take place from on the 28-30 June 2023 at ESTEC.
During the event the major R&D activities and studies coordinated by TEC-QEC concluded between 2019 and 2022 will be presented .
Registration is required for external visitors to access the venue. (No participation fee)
Comparison between Board level and component level testing (OSIP )
Investigation on intra-die variability and radiation-induced SEL in a COTS SRAM memory flying on Proba-V + Flight data analysis of SEL in a COTS Samsung SRAM and comparison with SEE test results
Set of recommendations for memory SEE stuck bit testing. (Stuck bits + ISB + SEFI + SEU)
Laser test results of the IS42S86400B-7TLI to explain the different SEFI mechanisms
TID test results on a large quantity of a COTS LM239 voltage comparator from 2 different vendors
SEE of a two LEON FT core processor design in RTG4 FPGA